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Bernhard A Ziegner

from Westford, MA
Age ~83

Bernhard Ziegner Phones & Addresses

  • 63 Graniteville Rd, Westford, MA 01886 (978) 692-2514
  • 7 Village Ln, Tyngsboro, MA 01879 (978) 649-1174
  • 7 Village Ln, Tyngsboro, MA 01879
  • Lowell, MA

Publications

Us Patents

Surface-Mounted Millimeter Wave Signal Source With Ridged Microstrip To Waveguide Transition

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US Patent:
6573803, Jun 3, 2003
Filed:
Oct 12, 2000
Appl. No.:
09/689295
Inventors:
Bernhard Alphonso Ziegner - Tyngsborough MA
Robert John Sletten - Bow NH
Stephen R. Brown - Derry NH
May Kyi Cho - Sudbury MA
Noyan Kinayman - Malden MA
Assignee:
Tyco Electronics Corp. - Middletown PA
International Classification:
H01P 5107
US Classification:
333 26, 333 34
Abstract:
A surface-mountable mm-wave signal source is provided. The surface-mountable mm-wave signal source comprises: a conductive metal base; a mm-wave signal source disposed over an upper portion of the metal base; a first radio frequency transmission line carrying a quasi-TEM signal from the mm-wave signal source, which is disposed over an upper portion of the metal base and proximate the signal source; a first mode transformer at least partially integrated into the upper portion of the metal base to convert the quasi-TEM signal carried by the planar transmission line into a rectangular waveguide mode signal; a waveguide well having upper and lower ends disposed within the base for carrying the rectangular waveguide mode signal from an upper portion of the base to a lower portion of the base; and a second mode transformer at least partially integrated into the lower portion of the base to convert the rectangular waveguide mode signal to a quasi-TEM signal within a second radio frequency transmission line. The mm-wave signal source preferably operates in a frequency range of from 35 to 94 GHz, more preferably a frequency range of 70 to 80 GHz.

Compact Slotted-Waveguide Spatial Power Divider/combiner/amplifier

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US Patent:
6828875, Dec 7, 2004
Filed:
Dec 9, 2002
Appl. No.:
10/315528
Inventors:
Eswarappa Channabasappa - Acton MA
Thongchai Hongsmatip - Lunenburg MA
Noyan Kinayman - Malden MA
Richard Alan Anderson - North Attleborough MA
Bernhard A. Ziegner - Tyngsborough MA
Assignee:
MIA-Com, Inc. - Lowell MA
International Classification:
H01P 512
US Classification:
333137, 333 34, 333286, 333295
Abstract:
A spatial power divider/combiner that comprises: a housing containing a first channel forming three sides of a rectangular input waveguide and a second channel forming three sides of a rectangular output waveguide; a board coupled to the housing, wherein the underside of the board forms the fourth side of the input and output waveguides; a series of slots etched on the underside of the board located in the input waveguide to divide an input signal; a series of slots etched on the underside of the board located in the output waveguide to recombine the divided signal; and a series of microstrip lines printed on the top side of the board to couple the input waveguide and the output waveguide. Additionally, the divider/combiner can comprise a series of active devices, such as MMIC power amplifier, to provide a spatial power amplifier.

Film-Based Microwave And Millimeter-Wave Circuits And Sensors

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US Patent:
6903541, Jun 7, 2005
Filed:
May 25, 2001
Appl. No.:
09/864123
Inventors:
Bernhard Alphonso Ziegner - Tyngsborough MA,
Robert John Sletten - Bow NH,
Assignee:
Tyco Electronics Corporation - Middletown PA
International Classification:
G01R023/04
H05K001/00
US Classification:
324 95, 174254, 361749
Abstract:
Flexible multilayer microwave or mm-wave circuits and sensors are provided having at least (a) a first metallization layer, at least a portion of the first metallization layer being adapted for operation at a frequency ranging from 20 GHz to 100 GHz; (b) a second metallization layer, at least a portion of the second metallization layer being adapted for operation as a ground plane; (c) a dielectric substrate layer, the dielectric substrate layer being disposed between the first and second metallization layers; and (d) a plurality of conductive vias extending through the dielectric substrate layer and electrically connecting portions of the first and second metallization layers.

Noncontacting Mic Ground Plane Coupling Using A Broadband Virtual Short Circuit Gap

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US Patent:
4611186, Sep 9, 1986
Filed:
Jul 29, 1985
Appl. No.:
6/759519
Inventors:
Bernhard A. Ziegner - Westford MA
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01P 500
US Classification:
333246
Abstract:
Electrical coupling to the ground plane of an MIC is accomplished by forming a gap adjacent an edge of the ground plane and causing a virtual short to appear across the gap. A two part, one-half wavelength transmission line transformer is used to provide the virtual short. The transformer is defined by the conductive members surrounding the MIC and is open at the end corresponding to the gap and shorted at the other end. The impedances of the two parts of the transformer are chosen to maximize the bandwidth of the virtual short.

Low Cost Reduced-Loss Printed Patch Planar Array Antenna

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US Patent:
6271792, Aug 7, 2001
Filed:
Jul 24, 1997
Appl. No.:
8/910347
Inventors:
Robert John Sletten - Bow NH
Eric Andrew Soshea - Westminster MA
Walter Leo Storkus - Canton MA
Bernhard A. Ziegner - Tyngsboro MA
Assignee:
The Whitaker Corp. - Wilmington DE
International Classification:
H01Q 138
US Classification:
343700MS
Abstract:
An antenna has a relatively thick primary dielectric between a ground plane and a conducting radiating element being fed by a conducting transmission line, first and second thin dielectrics on opposite sides of the primary dielectric, the relatively thick primary dielectric having a relatively lower dielectric constant than that of at least the second thin dielectric to increase the bandwidth transmission capability of the transmission line for a given impedance, the second thin dielectric couples substantially less power than is coupled with the primary dielectric and the second thin dielectric is of relatively higher dielectric constant promoting surface wave coupling and reduction of wave losses.

Field Effect Transistor Device

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US Patent:
4768079, Aug 30, 1988
Filed:
Oct 13, 1987
Appl. No.:
7/107954
Inventors:
Pramode Kandpal - Billerica MA
Jean C. Collinet - Scottsdale AZ
Bernhard A. Ziegner - Westford MA
James A. Bowen - Andover MA
Assignee:
M/A Com, Inc. - Burlington MA
International Classification:
H01L 2350
H01L 2976
H03B 914
US Classification:
357 74
Abstract:
A two-terminal field effect transistor device which is capable of operation as an oscillator including a field effect transistor connected in a two-terminal manner. The transistor has the usual drain source and gate electrodes and oscillating instability is provided by means of an inductance means of value so as to provide this circuit instability to enable circuit oscillations. The two-terminal arrangement is enabled by means of essentially interconnecting the gate and drain electrodes by way of said inductance means.

Millimeter Wave Module With An Interconnect From An Interior Cavity

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US Patent:
6064286, May 16, 2000
Filed:
Jul 31, 1998
Appl. No.:
9/126616
Inventors:
Bernhard Alphonso Ziegner - Westford MA
Robert John Sletten - Bow NH
Nitin Jain - Nashua NH
Steve Robert Brown - Derry NH
Assignee:
The Whitaker Corporation - Wilmington DE
International Classification:
H01P 500
US Classification:
333247
Abstract:
A packaged integrated circuit (20, 20a, 20b) which includes at least one waveguide port (44, 44a, 44b) and at least one interconnect (26, 26a, 26b) which is electrically connected to an integrated circuit (30, 30a, 30b).

Lcc Co-Planar Lead Frame Semiconductor Ic Package

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US Patent:
4543544, Sep 24, 1985
Filed:
Jan 4, 1984
Appl. No.:
6/568157
Inventors:
Bernhard A. Ziegner - Westford MA
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01P 508
US Classification:
333 34
Abstract:
An apparatus and method is disclosed for allowing faster and higher fidelity signals to be transmitted from a PC board to an IC by maintaining a constant impedance from the PC board to the IC. A leadless chip connector is used with a ground plane mounted co-planar to the conductor. As the conductor and ground planes extend toward the IC they decrease in width and the distance between the conductor and ground plane varies to maintain a constant impedance.
Bernhard A Ziegner from Westford, MA, age ~83 Get Report